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| MC100EPT22 3.3V Dual LVTTL/LVCMOS to Differential LVPECL Translator Description The MC100EPT22 is a dual LVTTL/LVCMOS to differential LVPECL translator. Because LVPECL (Positive ECL) levels are used only +3.3 V and ground are required. The small outline 8-lead package and the single gate of the EPT22 makes it ideal for those applications where space, performance, and low power are at a premium. Because the mature MOSAIC 5 process is used, low cost and high speed can be added to the list of features. Features http://onsemi.com MARKING DIAGRAMS* 8 8 1 SOIC-8 D SUFFIX CASE 751 1 8 8 1 TSSOP-8 DT SUFFIX CASE 948R 1 DFN8 MN SUFFIX CASE 506AA KA22 ALYWG G KPT22 ALYW G * * * * * * * 420 ps Typical Propagation Delay Maximum Frequency > 1.1 GHz Typical Operating Range: VCC = 3.0 V to 3.6 V with GND = 0 V PNP LVTTL Inputs for Minimal Loading Q Output Will Default HIGH with Inputs Open The 100 Series Contains Temperature Compensation. Pb-Free Packages are Available 1 A = Assembly Location L = Wafer Lot Y = Year W = Work Week M = Date Code G = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. (c) Semiconductor Components Industries, LLC, 2006 December, 2006 - Rev. 11 1 Publication Order Number: MC100EPT22/D 3S MG G 4 MC100EPT22 Q0 1 8 VCC Table 1. PIN DESCRIPTION PIN Q0, Q1, Q0, Q1 D0, D1 FUNCTION LVPECL Differential Outputs LVTTL Inputs Positive Supply Ground Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. Q0 2 LVPECL LVTTL 7 D0 Q1 3 6 D1 VCC GND Q1 4 5 GND EP Figure 1. 8-Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Human Body Model Machine Model Charged Device Model Pb Pkg Level 1 Level 1 Level 1 Value N/A N/A > 4 kV > 200 V > 2 kV Pb-Free Pkg Level 1 Level 3 Level 1 Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) SOIC-8 TSSOP-8 DFN8 Flammability Rating Transistor Count Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in 164 Devices http://onsemi.com 2 MC100EPT22 Table 3. MAXIMUM RATINGS Symbol VCC VI Iout TA Tstg qJA qJC qJA qJC qJA Tsol Power Supply Input Voltage Output Current Operating Temperature Range Storage Temperature Range Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Thermal Resistance (Junction-to-Ambient) Wave Solder Pb Pb-Free 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm SOIC-8 SOIC-8 SOIC-8 TSSOP-8 TSSOP-8 TSSOP-8 DFN8 DFN8 Parameter Condition 1 GND = 0 V GND = 0 V Continuous Surge VI v VCC Condition 2 Rating 6 6 to 0 50 100 -40 to +85 -65 to +150 190 130 41 to 44 185 140 41 to 44 129 84 265 265 Unit V V mA mA C C C/W C/W C/W C/W C/W C/W C/W C/W C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 4. TTL INPUT DC CHARACTERISTICS VCC = 3.3 V, GND = 0 V, TA= -40C to 85C Symbol IIH IIHH IIL VIK VIH VIL Characteristic Input HIGH Current Input HIGH Current MAX Input LOW Current Input Clamp Voltage Input HIGH Voltage Input LOW Voltage VIN = VCC VIN = 0.5 V IIN = -18 mA 2.0 0.8 Condition VIN = 2.7 V Min Typ Max 20 100 -0.6 -1.0 Unit mA mA mA V V V NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Table 5. PECL OUTPUT DC CHARACTERISTICS VCC = 3.3 V, GND = 0.0 V (Note 2) -40C Symbol ICC VOH VOL Characteristic Power Supply Current Output HIGH Voltage (Note 3) Output LOW Voltage (Note 3) Min 32 2155 1355 Typ 43 2280 1480 Max 55 2405 1605 Min 35 2155 1355 25C Typ 45 2280 1480 Max 60 2405 1605 Min 37 2155 1355 85C Typ 46 2280 1480 Max 62 2405 1605 Unit mA mV mV NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Output parameters vary 1:1 with VCC. 3. All loading with 50 W to VCC - 2.0 V. http://onsemi.com 3 MC100EPT22 Table 6. AC CHARACTERISTICS VCC = 3.0 V to 3.6 V, GND = 0.0 V (Note 4) -40C Symbol fmax tPLH, tPHL tskew tJITTER tr tf Characteristic Maximum Frequency (Figure 2) Propagation Delay to Output Differential Within-Device Skew (Note 5) Device-to-Device Skew (Note 6) Random Clock Jitter (Figure 2) Output Rise/Fall Times (20% - 80%) Q, Q 50 Min 0.8 250 Typ 1.1 400 50 200 0.2 110 650 100 400 <1 200 60 Max Min 0.8 250 25C Typ 1.1 420 50 200 0.2 120 675 100 425 <1 220 70 Max Min 0.8 300 85C Typ 1.1 500 50 200 0.2 140 700 100 400 <1 250 Max Unit GHz ps ps ps ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Measured using a 2.4 V source, 50% duty cycle clock source. All loading with 50 W to VCC - 2.0 V. 5. Skew is measured between outputs under identical transitions and conditions on any one device. 6. Device-to-Device Skew for identical transitions at identical VCC levels. 900 800 700 VOUTpp (mV) 600 500 400 300 200 9 8 JITTEROUT ps (RMS) 7 6 5 4 3 2 1 (JITTER) 1200 1400 1600 EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE 0 0 200 400 600 800 1000 FREQUENCY (MHz) 100 Figure 2. Fmax/Jitter http://onsemi.com 4 EE EE EE MC100EPT22 Q Driver Device Q Zo = 50 W 50 W 50 W D Zo = 50 W D Receiver Device VTT VTT = VCC - 2.0 V Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D - Termination of ECL Logic Devices.) ORDERING INFORMATION Device MC100EPT22D MC100EPT22DG MC100EPT22DR2 MC100EPT22DR2G MC100EPT22DT MC100EPT22DTG MC100EPT22DTR2 MC100EPT22DTR2G MC100EPT22MNR4 MC100EPT22MNR4G Package SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) DFN8 DFN8 (Pb-Free) Shipping 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 100 Units / Rail 100 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 1000 / Tape & Reel 1000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D AN1406/D AN1503/D AN1504/D AN1568/D AN1672/D AND8001/D AND8002/D AND8020/D AND8066/D AND8090/D - ECL Clock Distribution Techniques - Designing with PECL (ECL at +5.0 V) - ECLinPSt I/O SPiCE Modeling Kit - Metastability and the ECLinPS Family - Interfacing Between LVDS and ECL - The ECL Translator Guide - Odd Number Counters Design - Marking and Date Codes - Termination of ECL Logic Devices - Interfacing with ECLinPS - AC Characteristics of ECL Devices http://onsemi.com 5 MC100EPT22 PACKAGE DIMENSIONS SOIC-8 NB CASE 751-07 ISSUE AH -X- A 8 5 B 1 S 4 0.25 (0.010) M Y M -Y- G K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 C -Z- H D 0.25 (0.010) M SEATING PLANE N X 45 _ 0.10 (0.004) M J ZY S X S DIM A B C D G H J K M N S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 MC100EPT22 PACKAGE DIMENSIONS TSSOP-8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R-02 ISSUE A 8x K REF 0.10 (0.004) M 0.15 (0.006) T U S 2X TU S V S L/2 8 1 5 L PIN 1 IDENT 4 B -U- 0.25 (0.010) M 0.15 (0.006) T U S A -V- F DETAIL E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ C 0.10 (0.004) -T- SEATING PLANE D G DETAIL E -W- DIM A B C D F G K L M http://onsemi.com 7 MC100EPT22 PACKAGE DIMENSIONS DFN8 CASE 506AA-01 ISSUE D 1 D A B PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 --- 0.25 0.35 2X 0.10 C 2X 0.10 C 0.10 C 8X 0.08 C SEATING PLANE A1 e/2 1 8X 4 L K ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CCC CCC CCC CCC 8 E TOP VIEW A (A3) C e SIDE VIEW D2 E2 5 8X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW http://onsemi.com 8 MC100EPT22/D |
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